According to the Freedom Times, memory maker Winbond announced today that it has launched QspiNAND Flash with new features, which has been adopted by Qualcomm IoT modems of American IC design giants.
Winbond said that the company launched the industry's first 1.8V 512Mb (64MB) QspiNAND Flash to provide designers of new mobile network narrowband Internet of Things (IoT) modules with the correct storage capacity.
Winbond pointed out that in order to meet the growing global demand for high-capacity solutions, the company's Qspi NAND Flash is manufactured in Zhongke's 12-inch fab. Winbond is expanding its production capacity to cope with and ensure support for the expected growth of the automotive and IoT industries due to new business.
In addition, Vieri Vanghi, vice president of product management at Qualcomm, said that Qualcomm has conducted various tests and verifications on Winbond’s QspiNAND Flash. Currently, it is applied to Qualcomm’s 9205 LTE modem in the form of a stack KGD solution, allowing OEM customers to create an extremely With an exquisite system, we hope that both parties can continue to provide top-notch IoT technology solutions.
