TSMC issued a statement: It is expected that scrapped wafers will be fully replenished in the second quarter

  According to the Economic Daily, on January 29, TSMC issued a statement on the contaminated wafers of 14B factory, indicating that most of the affected wafers are expected to be replenished in the first quarter of this year. If there is any inability to make up, it will be in the second quarter. To make up, this single event will not affect the financial test.

Yesterday, TSMC confirmed that due to the supply of unqualified materials by chemical materials suppliers, the process of the Nanke 14B factory was problematic and tens of thousands of wafers were scrapped.

It is understood that due to the use of substandard chemical raw materials in the 14B plant, the wafer production is flawed, and this problem cannot be found in the production process, and the problem must be exposed after the production is completed.

TSMC's specific statement is as follows:

On January 19th, we found that the F14B's 12/16nm yield was problematic. After tracing, we learned that the problem lies in a batch of photoresist materials. This batch of raw materials comes from a manufacturer with many years of experience in supplying TSMC, but this batch of raw materials has a large error with the specifications of raw materials supplied in the past. We immediately deactivate this batch of non-compliant ingredients and immediately notify all affected customers.

In the past ten days, we have been closely communicating with all affected customers, including details of relevant replenishment and delivery. Based on our current capacity utilization rate of 12/16nm, the company expects most of the affected wafers to be Q1 is added back. If Q1 cannot be replenished, it should be able to make up in Q2. The company reiterates that this single event will not affect the financial test.