The overall semiconductor market may be weak, but TSMC's 7-nanometer manufacturing capacity is strong, and despite the uncertainties in the US-China trade war, orders, especially for Chinese customers, have continued into the first half of 2020. One of its main customers is Huawei, which is said to be launching the Kirin 990 chip with integrated 5G modem manufactured by TSMC's 7nm FinFET Plus EUV process.
Although TSMC is in a leading position in the foundry industry, the DRAM sector mainly sees three horses competing between Samsung Electronics, SK Hynix and Micron Technology. According to reports, a recent meeting between Micron CEO Sanjay Mehrotra and China’s Tsinghua Unigroup executives also sparked some speculation.
According to sources from Taiwan's IC design department, TSMC will see strong demand for 7nm chips in the first half of 2010: TSMC has already enjoyed orders for chips that require advanced 7nm node manufacturing, and order visibility will continue into the first half of 2020.
Huawei will introduce a 5G SoC manufactured using the 7nm EUV process: Huawei will launch its latest mobile processor, the Kirin 990, at the IFA 2019 trade show.
Sanjay Mehrotra, CEO of Micron Technology, visited China and met with Tsinghua Group executives, sparking speculation about potential cooperation between the two companies.