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Line Card

Henkel/Loctite

Henkel/Loctite

- Henkel Adhesive Electronics, a division of global materials innovator, Henkel Corporation, is focused on developing next-generation materials for a variety of applications in the industrial, consumer, handheld, wearables, display and emerging electronics market sectors.
Henkel’s leading electronics brands of LOCTITE, Multicore (now sold under the LOCTITE brand) and Bergquist have long been recognized as the product brands to trust for printed circuit board assembly applications. With a broad portfolio of materials including surface mount adhesives, advanced flux chemistries, encapsulants, high performance solder solutions, conductive adhesives, thermal management materials as well as CSP underfills and board protection materials, Henkel’s advanced formulations ensure maximum processability and reliable in-field performance.
LOCTITE - The LOCTITE brand is synonymous with quality, reliability and high performance. Within the electronics sector, LOCTITE is the premier brand for Henkel’s solder, flux, underfill, surface mount adhesive, printed ink, potting, display adhesive, structural adhesive and conformal coating product lines.
Bergquist - Now part of Henkel, the Bergquist line of thermal management materials delivers superior heat control for a variety of challenging applications. Known under the well-respected brands of Gap Pad®, Gap Filler, Thermal Clad®, Sil-Pad®, Liqui-Form®and Bond-Ply®, Henkel’s comprehensive thermal materials portfolio encompasses solutions that enable effective heat management from the substrate level through to final assembly.
Multicore - Formerly Multicore and now marketed as LOCTITE, LOCTITE solder products are among the industry’s most trusted and respected interconnect materials. Decades of solder formulation innovation have earned LOCTITE solder materials numerous industry awards and have enabled the electronics market’s move to lead-free, halogen-free, high-reliability solder processes. Game-changing formulations like temperature-stable LOCTITE GC 10 and LOCTITE GC 3W solder pastes help reduce costs, improve yield and provide more stable and reliable assembly processes. The LOCTITE line of solder products includes advanced flux formulations, leaded, lead-free and halogen-free solder pastes, high-reliability alloys, solder bar, preforms, and cored and solid wire.
Image Part Number Description View
142089 LOCTITE 3609 10CC EFD US RFQ
498887 HD 0242 STYCAST HARDENER GAL RFQ
230184 384 ADHESIVE OUTPUT SY25ML RFQ
230102 LOCTITE 3609 30CC FUJI SENS US RFQ
386825 Image 386825 63/37 400 1% .032DIA/21SWG RFQ
2023641 Image 2023641 LOCTITE GC 10 SAC305T3 885 53U RFQ
GPEMI1.0-0.080-01-0816 Image GPEMI1.0-0.080-01-0816 GAP PAD EMI 8X16" .080" RFQ
SPK10-0.006-00-22 Image SPK10-0.006-00-22 THERMAL PAD DO-4 LARGE K10 RFQ
232518 315 SELF SHIM THERM ADH CR300ML RFQ
498888 HD 0243 STYCAST HARDENER GAL RFQ
135254 384 ADHESIVE OUTPUT CR300ML RFQ
150967 Image 150967 SI5084 NUVA-SIL 300ML CQ/BN RFQ
231161 LOCTITE 3609 20CC PAN SY US RFQ
235134 3621 DISPENS CHIPBOND 20ML PAN RFQ
541410 ES 2424 LOCTITE STYCAST RFQ
293417 3621 DISPENS CHIPBOND 30ML IWASH RFQ
230167 LOCTITE 3609 30CC EFD US RFQ
235136 3621 DISPENS CHIPBOND 30ML FUJI RFQ
223102 LOCTITE 3609 30CC IWASH SY US RFQ
135263 Image 135263 SI 5140 METHOXY 300ML CQ/BN RFQ
232568 315 SELF SHIM THERM ADH SY25ML RFQ
135264 Image 135264 SI 5140 METHOXY 85 GR TB/BN RFQ
234325 Image 234325 LOCTITE NC RTV SIL CL 300ML RFQ
230079 Image 230079 SI 5145 RTV SILICONE 300ML CQ/BN RFQ
234323 Image 234323 LOCTITE NC RTV SIL CL 80ML RFQ
244565 CHIPBONDER 3616 300CC CQ RFQ
1047433 Image 1047433 3508 CORNERBOND 30 ML RFQ
1189741 LOCTITE ABLESTIK 2332-17 RFQ
673829 Image 673829 97SC 400 2% .032DIA/21SWG RFQ
1769646 Image 1769646 SOLDER PASTE HF 212 - 500GRAM JA RFQ
397127 Image 397127 SN62 370 3% .024DIA/23SWG RFQ
M00601 MF200 FLUX PENS (NO-CLEAN) 10ML RFQ
386818 Image 386818 63/37 HYDRO-X 2% .032DIA/21SWG RFQ
400395 Image 400395 TOUCH SCRN 5-WIRE 6.4" ANTI-GLR RFQ
803118 Image 803118 BOARD LED IMS GOLDEN DRAGON RFQ
Q3-0.005-AC-1212-NA THERMAL PAD RECT .005" Q3 ADH RFQ
386848 96SC C502 5C 0.81MM 0.5KG AM RFQ
386838 60/40 C511 5C 1.22MM 0.5KG.048" RFQ
1007354 BI58 LM100 AAS90V PASTE RFQ
386820 Image 386820 63/37 HYDRO-X 2% .022DIA/24SWG RFQ
848874 97SC C502 3C 0.81MM 0.5KG AM RFQ
289398 95A 362 5C 1.2MM 0.5KG RLR RFQ
733024 96SC C400 3C 0.56MM 0.25KG.022" RFQ
838498 97SC C502 3C 0.25MM 0.25KG AM RFQ
386863 96S C400 5C 0.56MM 0.5KG AM RFQ
1354298 63S4 WS200 ACP 500G JAR RFQ
554889 Image 554889 63/37 BAR SLDR 2LB +/- 0.2LB BAR RFQ
412183 96SC C511 3C 1.02MM 0.5KG .040" RFQ
1042100 60/40C511 3C 1.63MM AF 2.5KG AM RFQ
583489 Image 583489 63/37 MP200 SOLDER FLUX 25GM RFQ