| Supplier Device Package: | 676-FBGA (27x27) |
|---|---|
| Speed: | 166MHz |
| Series: | SmartFusion®2 |
| Primary Attributes: | FPGA - 60K Logic Modules |
| Peripherals: | DDR, PCIe, SERDES |
| Packaging: | Tray |
| Package / Case: | 676-BGA |
| Operating Temperature: | -40°C ~ 100°C (TJ) |
| Number of I/O: | 387 |
| MCU RAM: | 64KB |
| MCU Flash: | 256KB |
| Core Processor: | ARM® Cortex®-M3 |
| Connectivity: | CAN, Ethernet, I²C, SPI, UART/USART, USB |
| Architecture: | MCU, FPGA |
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